FYP 2 EXHIBITION DAY BRIEFING AND DO THE CASING

On this week, i have attend FYP2 Exhibition Day Briefing to know about tips & tricks on presentation day. I also do the casing for my hardware and transfer my components from breadboard to the donut board.

ACTIVITY 

1) FYP 2 EXHIBITION DAY BRIEFING

a) Date : 10/4/2019

b) Time : 3pm - 5pm

c) Location : TTL 2 

d) CO-ordinator : Dr. Mohd Noor and Dr. Marwangi

In this briefing, Dr. Mohd Noor has giving the tips & tricks regarding the presentation day that will be held on Week 11. He also give us some useful advice to be use when present to the assesssor. After that, Dr. Marwangi has explained about the Submission of Progress Report which is our thesis. Next, she has show us some example of good and excellent final report and technical paper. After all, all the students including me are well prepared by the explanation by the co-ordinator.

2) HARDWARE CASING

In this task , i have buy some components to make my project looks well which is i have used 3 LED, green, yellow and red to indicate the level of air quality. I also buy donut board to do the soldering of the component.

Below is the picture of my prototype after been soldering which include inside and outside of the box.